天上人间av在线观看全集免费完整版第54集 雪梨影院,翁虹电影原创在线观看 翁虹电影原创高清无删减 雪梨影院

发布日期:2021年11月27日
天上人间av在线观看全集免费完整版第54集 雪梨影院,翁虹电影原创在线观看 翁虹电影原创高清无删减 雪梨影院
MEMS与传感器
MEMS与传感器

MEMSand Sensors

With the growing consumer demand for smartdevices capable of sensing, communicating and controlling applications, MEMSand Sensors are becoming a critical packaging approach due to their smallerfootprint, thinner profile and functional integration capabilities. MEMS andsensors can be found in a wide range of systems in the communications,consumer, medical, industrial and automotive markets

Sensors

A sensor is a device or system thatdetects/measures a physical property and then records, reports and/or respondsto the stimulation. Sensors are typically assembled in a module that respondsbased on the stimulation or feed to the sensor. There are many different typesof sensors and applications such as:

• Pressure sensor

• Inertial sensor

• Microphone

• Proximity sensor

• Fingerprint sensor

Micro-Electro-Mechanical-Systems(MEMS)

MEMS is a specialized sensor that combinesmechanical and electrical components in a discrete format or a module. MEMS aretypically multi-die solutions such as a sensing die paired with anapplication-specific integrated circuit (ASIC). A MEMS device can consist of mechanical elements, sensors, actuators,and electrical and electronics devices on a common silicon substrate. Some ofthe advantages of using a MEMS based sensor in consumer, automotive and mobileapplications are  smaller size,  low power consumption, lower cost, etc.

IntegratedTurnkey Solutions

Our broad technology portfolio anddedicated MEMS team can provide a comprehensive turnkey solution to supportyour production ramp, including package co-design, simulation, Bill of Material(BOM) qualification, assembly, quality assurance and in-house test solutions. JCETdeliverssmaller form factor, higher performance and lower cost solutions for our customers’end products. Our innovative integration solutions can help your businessachieve the size, performance and cost requirements for your MEMS and sensorapplications.

1.embedded Wafer Level Ball Grid Array (eWLB) - single die, multi-die and stacked Package-on-Package configurations
2.Wafer Level Chip Scale Package (WLCSP) - very small single die
3.Flip Chip  Chip Scale Package (fcCSP)- single or multi-die flip chip configurations
4.Fine Pitch Ball Grid Array (FBGA) - single or multi-die configurations
5.Land Grid Array(LGA) - single or multi-die configurations
6.Quad Flat No-Lead (QFN) - single or multi-die configurations

FullTurnkey Flip Chip Services at JCET

With our unmatched strength in wafer levelpackaging, wafer probe and final test, JCET is uniquely positioned to provide fullturnkey processing to our customers. JCET offers full turnkey flip chip servicesranging from design through production, including high speed, high pin countdigital and RF testing.

联系我们 | 客户查询 |  法律声明

联系我们客户查询法律声明

版权所有@江苏长电科技股份有限公司 保留一切权利 苏ICP备05082751号-132028102000607
版权所有@江苏长电科技股份有限公司
保留一切权利
32028102000607
天上人间av在线观看全集免费完整版第54集 雪梨影院,翁虹电影原创在线观看 翁虹电影原创高清无删减 雪梨影院